Commission Delegated Directive (EU) 2019/172Dangos y teitl llawn

Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages (Text with EEA relevance)

ANNEX

In Annex III, entry 15 is replaced by the following:

‘15Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

Applies to categories 8, 9 and 11 and expires on:

  • 21 July 2021 for categories 8 and 9 other than in vitro diagnostic medical devices and industrial monitoring and control instruments;

  • 21 July 2023 for category 8 in vitro diagnostic medical devices;

  • 21 July 2024 for category 9 industrial monitoring and control instruments, and for category 11.

15(a)

Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:

  • a semiconductor technology node of 90 nm or larger;

  • a single die of 300 mm2 or larger in any semiconductor technology node;

  • stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.

Applies to categories 1 to 7 and 10 and expires on 21 July 2021.’