Directive 2011/65/EU of the European Parliament and of the CouncilShow full title

Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (recast) (Text with EEA relevance)

ANNEX IU.K. Categories of EEE covered by this Directive

1.Large household appliances.U.K.

2.Small household appliances.U.K.

3.IT and telecommunications equipment.U.K.

4.Consumer equipment.U.K.

5.Lighting equipment.U.K.

6.Electrical and electronic tools.U.K.

7.Toys, leisure and sports equipment.U.K.

8.Medical devices.U.K.

9.Monitoring and control instruments including industrial monitoring and control instruments.U.K.

10.Automatic dispensers.U.K.

11.Other EEE not covered by any of the categories above.U.K.

ANNEX IIU.K. Restricted substances referred to in Article 4(1) and maximum concentration values tolerated by weight in homogeneous materials

  • Lead (0,1 %)

  • Mercury (0,1 %)

  • Cadmium (0,01 %)

  • Hexavalent chromium (0,1 %)

  • Polybrominated biphenyls (PBB) (0,1 %)

  • Polybrominated diphenyl ethers (PBDE) (0,1 %)

ANNEX IIIU.K.

Applications exempted from the restriction in Article 4(1)

ExemptionScope and dates of applicability
1Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
1(a)For general lighting purposes < 30 W: 5 mgExpires on 31 December 2011; 3,5 mg may be used per burner after 31 December 2011 until 31 December 2012; 2,5 mg shall be used per burner after 31 December 2012
1(b)For general lighting purposes ≥ 30 W and < 50 W: 5 mgExpires on 31 December 2011; 3,5 mg may be used per burner after 31 December 2011
1(c)For general lighting purposes ≥ 50 W and < 150 W: 5 mg
1(d)For general lighting purposes ≥ 150 W: 15 mg
1(e)For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mmNo limitation of use until 31 December 2011; 7 mg may be used per burner after 31 December 2011
1(f)For special purposes: 5 mg
[F11(g) For general lighting purposes < 30 W with a lifetime equal or above 20 000 h: 3,5 mg Expires on 31 December 2017]
2(a)Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):
2(a)(1)Tri-band phosphor with normal lifetime and a tube diameter < 9 mm (e.g. T2): 5 mgExpires on 31 December 2011; 4 mg may be used per lamp after 31 December 2011
2(a)(2)Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mgExpires on 31 December 2011; 3 mg may be used per lamp after 31 December 2011
2(a)(3)Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 5 mgExpires on 31 December 2011; 3,5 mg may be used per lamp after 31 December 2011
2(a)(4)Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12): 5 mgExpires on 31 December 2012; 3,5 mg may be used per lamp after 31 December 2012
2(a)(5)Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mgExpires on 31 December 2011; 5 mg may be used per lamp after 31 December 2011
2(b)Mercury in other fluorescent lamps not exceeding (per lamp):
2(b)(1)Linear halophosphate lamps with tube > 28 mm (e.g. T10 and T12): 10 mgExpires on 13 April 2012
2(b)(2)Non-linear halophosphate lamps (all diameters): 15 mgExpires on 13 April 2016
2(b)(3)Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9)No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011
2(b)(4)Lamps for other general lighting and special purposes (e.g. induction lamps)No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011
3Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
3(a)Short length (≤ 500 mm)No limitation of use until 31 December 2011; 3,5 mg may be used per lamp after 31 December 2011
3(b)Medium length (> 500 mm and ≤ 1 500 mm)No limitation of use until 31 December 2011; 5 mg may be used per lamp after 31 December 2011
3(c)Long length (> 1 500 mm)No limitation of use until 31 December 2011; 13 mg may be used per lamp after 31 December 2011
4(a)Mercury in other low pressure discharge lamps (per lamp)No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011
4(b)Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60:
4(b)-IP ≤ 155 WNo limitation of use until 31 December 2011; 30 mg may be used per burner after 31 December 2011
4(b)-II155 W < P ≤ 405 WNo limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011
4(b)-IIIP > 405 WNo limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011
4(c)Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):
4(c)-IP ≤ 155 WNo limitation of use until 31 December 2011; 25 mg may be used per burner after 31 December 2011
4(c)-II155 W < P ≤ 405 WNo limitation of use until 31 December 2011; 30 mg may be used per burner after 31 December 2011
4(c)-IIIP > 405 WNo limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011
4(d)Mercury in High Pressure Mercury (vapour) lamps (HPMV)Expires on 13 April 2015
4(e)Mercury in metal halide lamps (MH)
4(f)Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex
5(a)Lead in glass of cathode ray tubes
5(b)Lead in glass of fluorescent tubes not exceeding 0,2 % by weight
6(a)Lead as an alloying element in steel for machining purposes and in galvanised steel containing up to 0,35 % lead by weight
6(b)Lead as an alloying element in aluminium containing up to 0,4 % lead by weight
6(c)Copper alloy containing up to 4 % lead by weight
7(a)Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
7(b)Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications
7(c)-IElectrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound
7(c)-IILead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-IIILead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DCExpires on 1 January 2013 and after that date may be used in spare parts for EEE placed on the market before 1 January 2013
[F27(c)-IV Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors Expires on 21 July 2016]
8(a)Cadmium and its compounds in one shot pellet type thermal cut-offsExpires on 1 January 2012 and after that date may be used in spare parts for EEE placed on the market before 1 January 2012
8(b)Cadmium and its compounds in electrical contacts
9Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution
9(b)Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications
11(a)Lead used in C-press compliant pin connector systemsMay be used in spare parts for EEE placed on the market before 24 September 2010
11(b)Lead used in other than C-press compliant pin connector systemsExpires on 1 January 2013 and after that date may be used in spare parts for EEE placed on the market before 1 January 2013
12Lead as a coating material for the thermal conduction module C-ringMay be used in spare parts for EEE placed on the market before 24 September 2010
13(a)Lead in white glasses used for optical applications
13(b)Cadmium and lead in filter glasses and glasses used for reflectance standards
14Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weightExpired on 1 January 2011 and after that date may be used in spare parts for EEE placed on the market before 1 January 2011
15Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
16Lead in linear incandescent lamps with silicate coated tubesExpires on 1 September 2013
17Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications
18(a)Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)Expired on 1 January 2011
18(b)Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb)
19Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)Expires on 1 June 2011
20Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)Expires on 1 June 2011
21Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses
23Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and lessMay be used in spare parts for EEE placed on the market before 24 September 2010
24Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
25Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring
26Lead oxide in the glass envelope of black light blue lampsExpires on 1 June 2011
27Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakersExpired on 24 September 2010
29Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EECa
30Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more
31Lead in soldering materials in mercury free flat fluorescent lamps (which, e.g. are used for liquid crystal displays, design or industrial lighting)
32Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes
33Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers
34Lead in cermet-based trimmer potentiometer elements
36Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per displayExpired on 1 July 2010
37Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body
38Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide
39Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systemsExpires on 1 July 2014
[F340 Cadmium in photoresistors for analogue optocouplers applied in professional audio equipment Expires on 31 December 2013]

Textual Amendments

ANNEX IVU.K. Applications exempted from the restriction in Article 4(1) specific to medical devices and monitoring and control instruments

Equipment utilising or detecting ionising radiationU.K.

1.Lead, cadmium and mercury in detectors for ionising radiation.U.K.

2.Lead bearings in X-ray tubes.U.K.

3.Lead in electromagnetic radiation amplification devices: micro-channel plate and capillary plate.U.K.

4.Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons.U.K.

5.Lead in shielding for ionising radiation.U.K.

6.Lead in X-ray test objects.U.K.

7.Lead stearate X-ray diffraction crystals.U.K.

8.Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers.U.K.

Sensors, detectors and electrodesU.K.

1a.Lead and cadmium in ion selective electrodes including glass of pH electrodes.U.K.
1b.Lead anodes in electrochemical oxygen sensors.U.K.
1c.Lead, cadmium and mercury in infra-red light detectors.U.K.
1d.Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide.U.K.

OthersU.K.

9.Cadmium in helium-cadmium lasers.U.K.

10.Lead and cadmium in atomic absorption spectroscopy lamps.U.K.

11.Lead in alloys as a superconductor and thermal conductor in MRI.U.K.

[F412. Lead and cadmium in metallic bonds creating superconducting magnetic circuits in MRI, SQUID, NMR (Nuclear Magnetic Resonance) or FTMS (Fourier Transform Mass Spectrometer) detectors. Expires on 30 June 2021 .] U.K.

Textual Amendments

13.Lead in counterweights.U.K.

14.Lead in single crystal piezoelectric materials for ultrasonic transducers.U.K.

15.Lead in solders for bonding to ultrasonic transducers.U.K.

16.Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments not exceeding 20 mg of mercury per switch or relay.U.K.

17.Lead in solders in portable emergency defibrillators.U.K.

18.Lead in solders of high performance infrared imaging modules to detect in the range 8-14 μm.U.K.

19.Lead in Liquid crystal on silicon (LCoS) displays.U.K.

20.Cadmium in X-ray measurement filters.U.K.

[F521. Cadmium in phosphor coatings in image intensifiers for X-ray images until 31 December 2019 and in spare parts for X-ray systems placed on the EU market before 1 January 2020 .] U.K.

Textual Amendments

[F622. Lead acetate marker for use in stereotactic head frames for use with CT and MRI and in positioning systems for gamma beam and particle therapy equipment. Expires on 30 June 2021 .] U.K.

Textual Amendments

[F723. Lead as an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation. Expires on 30 June 2021 .] U.K.

Textual Amendments

[F824. Lead enabling vacuum tight connections between aluminium and steel in X-ray image intensifiers. Expires on 31 December 2019 .] U.K.

Textual Amendments

[F925. Lead in the surface coatings of pin connector systems requiring nonmagnetic connectors which are used durably at a temperature below – 20 °C under normal operating and storage conditions. Expires on 30 June 2021 .] U.K.

Textual Amendments

[F1026. Lead in U.K.

  • solders on printed circuit boards,

  • termination coatings of electrical and electronic components and coatings of printed circuit boards,

  • solders for connecting wires and cables,

  • solders connecting transducers and sensors,

that are used durably at a temperature below – 20 °C under normal operating and storage conditions.

Expires on 30 June 2021 .]

Textual Amendments

[F1127. Lead in U.K.

  • solders,

  • termination coatings of electrical and electronic components and printed circuit boards,

  • connections of electrical wires, shields and enclosed connectors,

which are used in

(a)

magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere, or

(b)

magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy.

Expires on 30 June 2020 .]

Textual Amendments

[F1228. Lead in solders for mounting cadmium telluride and cadmium zinc telluride digital array detectors to printed circuit boards. Expires on 31 December 2017 .] U.K.

Textual Amendments

[F1329. Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices (category 8) and/or in industrial monitoring and control instruments. Expires on 30 June 2021 .] U.K.

Textual Amendments

[F1430. Hexavalent chromium in alkali dispensers used to create photocathodes in X-ray image intensifiers until 31 December 2019 and in spare parts for X-ray systems placed on the EU market before 1 January 2020 .] U.K.

Textual Amendments

[F1531. Lead, cadmium and hexavalent chromium in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021 , provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is notified to the consumer. Expires on 21 July 2021 .] U.K.

Textual Amendments

[F1632. Lead in solders on printed circuit boards of detectors and data acquisition units for Positron Emission Tomographs which are integrated into Magnetic Resonance Imaging equipment. Expires on 31 December 2019 .] U.K.

Textual Amendments

[F1733. Lead in solders on populated printed circuit boards used in Directive 93/42/EEC class IIa and IIb mobile medical devices other than portable emergency defibrillators. Expires on 30 June 2016 for class IIa and on 31 December 2020 for class IIb.] U.K.

Textual Amendments

[F1834. Lead as an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi 2 O 5 :Pb) phosphors. Expires on 22 July 2021 .] U.K.

Textual Amendments

ANNEX VU.K. Applications for granting, renewing and revoking exemptions as referred to in Article 5

Applications for exemptions, renewal of exemptions or, mutatis mutandis, for revoking an exemption may be submitted by a manufacturer, the authorised representative of a manufacturer, or any economic operator in the supply chain and shall include at least the following:

(a)

the name, address and contact details of the applicant;

(b)

information on the material or component and the specific uses of the substance in the material and component for which an exemption, or its revocation, is requested and its particular characteristics;

(c)

verifiable and referenced justification for an exemption, or its revocation, in line with the conditions established in Article 5;

(d)

an analysis of possible alternative substances, materials or designs on a life-cycle basis, including, when available, information about independent research, peer-review studies and development activities by the applicant and an analysis of the availability of such alternatives;

(e)

information on the possible preparation for reuse or recycling of materials from waste EEE, and on the provisions relating to the appropriate treatment of waste according to Annex II to Directive 2002/96/EC;

(f)

other relevant information;

(g)

the proposed actions to develop, request the development and/or to apply possible alternatives including a timetable for such actions by the applicant;

(h)

where appropriate, an indication of the information which should be regarded as proprietary accompanied by verifiable justification;

(i)

when applying for an exemption, proposal for a precise and clear wording for the exemption;

(j)

a summary of the application.

ANNEX VIU.K. EU DECLARATION OF CONFORMITY

1.No … (unique identification of the EEE):U.K.

2.Name and address of the manufacturer or his authorised representative:U.K.

3.This declaration of conformity is issued under the sole responsibility of the manufacturer (or installer):U.K.

4.Object of the declaration (identification of EEE allowing traceability. It may include a photograph, where appropriate):U.K.

5.The object of the declaration described above is in conformity with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment(1):U.K.

6.Where applicable, references to the relevant harmonised standards used or references to the technical specifications in relation to which conformity is declared:U.K.

7.Additional information:U.K.

Signed for and on behalf of: …

(place and date of issue):

(name, function) (signature):

ANNEX VIIU.K.

PART AU.K.

Repealed Directive with its successive amendments

(referred to in Article 26)

Directive 2002/95/EC of the European Parliament and of the Council(OJ L 37, 13.2.2003, p. 19).
Commission Decision 2005/618/EC(OJ L 214, 19.8.2005, p. 65).
Commission Decision 2005/717/EC(OJ L 271, 15.10.2005, p. 48).
Commission Decision 2005/747/EC(OJ L 280, 25.10.2005, p. 18).
Commission Decision 2006/310/EC(OJ L 115, 28.4.2006, p. 38).
Commission Decision 2006/690/EC(OJ L 283, 14.10.2006, p. 47).
Commission Decision 2006/691/EC(OJ L 283, 14.10.2006, p. 48).
Commission Decision 2006/692/EC(OJ L 283, 14.10.2006, p. 50).
Directive 2008/35/EC of the European Parliament and of the Council(OJ L 81, 20.3.2008, p. 67).
Commission Decision 2008/385/EC(OJ L 136, 24.5.2008, p. 9).
Commission Decision 2009/428/EC(OJ L 139, 5.6.2009, p. 32).
Commission Decision 2009/443/EC(OJ L 148, 11.6.2009, p. 27).
Commission Decision 2010/122/EU(OJ L 49, 26.2.2010, p. 32).
Commission Decision 2010/571/EU(OJ L 251, 25.9.2010, p. 28).

PART BU.K.

List of time-limits for transposition into national law

(referred to in Article 26)

DirectiveDeadline for transposition
2002/95/EC12 August 2004
2008/35/EC—

ANNEX VIIIU.K.

Correlation table

Directive 2002/95/ECThis Directive
Article 1Article 1
Article 2(1)Article 2(1), 2(2), Annex I
Article 2(2)Article 2(3)
Article 2(3)Article 2(4), introductory wording
—Article 2(4)
Article 3(a)Article 3(1),(2)
Article 3(b)—
—Article 3(6)-(28)
Article 4(1)Article 4(1), Annex II
—Article 4(3)-(4)
Article 4(2)Article 4(6)
Article 4(3)—
Article 5(1), introductory wordingArticle 5(1), introductory wording
Article 5(1)(a)Article 4(2)
Article 5(1)(b)Article 5(1)(a), first and third indents
—

Article 5(1)(a), second indent

Article 5(1)(a), final paragraph

Article 5(1)(c)Article 5(1)(b)
—

Article 5(2)

Article 5(3)-(6)

Article 5(2)Article 5(7)
—Article 5(8)
Article 6Article 6
—Article 7-18
Article 7Articles 19-22
Article 8Article 23
Article 9Article 25
—Article 26
Article 10Article 27
Article 11Article 28
—Annexes I-II
Annex, points 1-39Annex III, points 1-39
—Annexes IV, V, VI-VIII