ANNEXU.K.
In Annex IV to Directive 2011/65/EU, point 26 is replaced by the following:
‘26.Lead in the following applications that are used durably at a temperature below – 20 °C under normal operating and storage conditions:
(a)
solders on printed circuit boards;
(b)
termination coatings of electrical and electronic components and coatings of printed circuit boards;
(c)
solders for connecting wires and cables;
(d)
solders connecting transducers and sensors.
Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below – 150 °C.
These exemptions expire on 30 June 2021.’