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ANNEXU.K.

In Annex IV to Directive 2011/65/EU, point 26 is replaced by the following:

26.Lead in the following applications that are used durably at a temperature below – 20 °C under normal operating and storage conditions:

(a)

solders on printed circuit boards;

(b)

termination coatings of electrical and electronic components and coatings of printed circuit boards;

(c)

solders for connecting wires and cables;

(d)

solders connecting transducers and sensors.

Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below – 150 °C.

These exemptions expire on 30 June 2021.