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- Original (As adopted by EU)
Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (recast) (Text with EEA relevance)
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This is the original version (as it was originally adopted).
Lead (0,1 %)
Mercury (0,1 %)
Cadmium (0,01 %)
Hexavalent chromium (0,1 %)
Polybrominated biphenyls (PBB) (0,1 %)
Polybrominated diphenyl ethers (PBDE) (0,1 %)
Exemption | Scope and dates of applicability | |
---|---|---|
1 | Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): | |
1(a) | For general lighting purposes < 30 W: 5 mg | Expires on 31 December 2011; 3,5 mg may be used per burner after 31 December 2011 until 31 December 2012; 2,5 mg shall be used per burner after 31 December 2012 |
1(b) | For general lighting purposes ≥ 30 W and < 50 W: 5 mg | Expires on 31 December 2011; 3,5 mg may be used per burner after 31 December 2011 |
1(c) | For general lighting purposes ≥ 50 W and < 150 W: 5 mg | |
1(d) | For general lighting purposes ≥ 150 W: 15 mg | |
1(e) | For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm | No limitation of use until 31 December 2011; 7 mg may be used per burner after 31 December 2011 |
1(f) | For special purposes: 5 mg | |
2(a) | Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): | |
2(a)(1) | Tri-band phosphor with normal lifetime and a tube diameter < 9 mm (e.g. T2): 5 mg | Expires on 31 December 2011; 4 mg may be used per lamp after 31 December 2011 |
2(a)(2) | Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mg | Expires on 31 December 2011; 3 mg may be used per lamp after 31 December 2011 |
2(a)(3) | Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 5 mg | Expires on 31 December 2011; 3,5 mg may be used per lamp after 31 December 2011 |
2(a)(4) | Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12): 5 mg | Expires on 31 December 2012; 3,5 mg may be used per lamp after 31 December 2012 |
2(a)(5) | Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mg | Expires on 31 December 2011; 5 mg may be used per lamp after 31 December 2011 |
2(b) | Mercury in other fluorescent lamps not exceeding (per lamp): | |
2(b)(1) | Linear halophosphate lamps with tube > 28 mm (e.g. T10 and T12): 10 mg | Expires on 13 April 2012 |
2(b)(2) | Non-linear halophosphate lamps (all diameters): 15 mg | Expires on 13 April 2016 |
2(b)(3) | Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9) | No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011 |
2(b)(4) | Lamps for other general lighting and special purposes (e.g. induction lamps) | No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011 |
3 | Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): | |
3(a) | Short length (≤ 500 mm) | No limitation of use until 31 December 2011; 3,5 mg may be used per lamp after 31 December 2011 |
3(b) | Medium length (> 500 mm and ≤ 1 500 mm) | No limitation of use until 31 December 2011; 5 mg may be used per lamp after 31 December 2011 |
3(c) | Long length (> 1 500 mm) | No limitation of use until 31 December 2011; 13 mg may be used per lamp after 31 December 2011 |
4(a) | Mercury in other low pressure discharge lamps (per lamp) | No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011 |
4(b) | Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60: | |
4(b)-I | P ≤ 155 W | No limitation of use until 31 December 2011; 30 mg may be used per burner after 31 December 2011 |
4(b)-II | 155 W < P ≤ 405 W | No limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011 |
4(b)-III | P > 405 W | No limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011 |
4(c) | Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): | |
4(c)-I | P ≤ 155 W | No limitation of use until 31 December 2011; 25 mg may be used per burner after 31 December 2011 |
4(c)-II | 155 W < P ≤ 405 W | No limitation of use until 31 December 2011; 30 mg may be used per burner after 31 December 2011 |
4(c)-III | P > 405 W | No limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011 |
4(d) | Mercury in High Pressure Mercury (vapour) lamps (HPMV) | Expires on 13 April 2015 |
4(e) | Mercury in metal halide lamps (MH) | |
4(f) | Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex | |
5(a) | Lead in glass of cathode ray tubes | |
5(b) | Lead in glass of fluorescent tubes not exceeding 0,2 % by weight | |
6(a) | Lead as an alloying element in steel for machining purposes and in galvanised steel containing up to 0,35 % lead by weight | |
6(b) | Lead as an alloying element in aluminium containing up to 0,4 % lead by weight | |
6(c) | Copper alloy containing up to 4 % lead by weight | |
7(a) | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) | |
7(b) | Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications | |
7(c)-I | Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound | |
7(c)-II | Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher | |
7(c)-III | Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC | Expires on 1 January 2013 and after that date may be used in spare parts for EEE placed on the market before 1 January 2013 |
8(a) | Cadmium and its compounds in one shot pellet type thermal cut-offs | Expires on 1 January 2012 and after that date may be used in spare parts for EEE placed on the market before 1 January 2012 |
8(b) | Cadmium and its compounds in electrical contacts | |
9 | Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution | |
9(b) | Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications | |
11(a) | Lead used in C-press compliant pin connector systems | May be used in spare parts for EEE placed on the market before 24 September 2010 |
11(b) | Lead used in other than C-press compliant pin connector systems | Expires on 1 January 2013 and after that date may be used in spare parts for EEE placed on the market before 1 January 2013 |
12 | Lead as a coating material for the thermal conduction module C-ring | May be used in spare parts for EEE placed on the market before 24 September 2010 |
13(a) | Lead in white glasses used for optical applications | |
13(b) | Cadmium and lead in filter glasses and glasses used for reflectance standards | |
14 | Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight | Expired on 1 January 2011 and after that date may be used in spare parts for EEE placed on the market before 1 January 2011 |
15 | Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages | |
16 | Lead in linear incandescent lamps with silicate coated tubes | Expires on 1 September 2013 |
17 | Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications | |
18(a) | Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb) | Expired on 1 January 2011 |
18(b) | Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) | |
19 | Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL) | Expires on 1 June 2011 |
20 | Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs) | Expires on 1 June 2011 |
21 | Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses | |
23 | Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and less | May be used in spare parts for EEE placed on the market before 24 September 2010 |
24 | Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors | |
25 | Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring | |
26 | Lead oxide in the glass envelope of black light blue lamps | Expires on 1 June 2011 |
27 | Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers | Expired on 24 September 2010 |
29 | Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EECa | |
30 | Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more | |
31 | Lead in soldering materials in mercury free flat fluorescent lamps (which, e.g. are used for liquid crystal displays, design or industrial lighting) | |
32 | Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes | |
33 | Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers | |
34 | Lead in cermet-based trimmer potentiometer elements | |
36 | Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display | Expired on 1 July 2010 |
37 | Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body | |
38 | Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide | |
39 | Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systems | Expires on 1 July 2014 |
Applications for exemptions, renewal of exemptions or, mutatis mutandis, for revoking an exemption may be submitted by a manufacturer, the authorised representative of a manufacturer, or any economic operator in the supply chain and shall include at least the following:
the name, address and contact details of the applicant;
information on the material or component and the specific uses of the substance in the material and component for which an exemption, or its revocation, is requested and its particular characteristics;
verifiable and referenced justification for an exemption, or its revocation, in line with the conditions established in Article 5;
an analysis of possible alternative substances, materials or designs on a life-cycle basis, including, when available, information about independent research, peer-review studies and development activities by the applicant and an analysis of the availability of such alternatives;
information on the possible preparation for reuse or recycling of materials from waste EEE, and on the provisions relating to the appropriate treatment of waste according to Annex II to Directive 2002/96/EC;
other relevant information;
the proposed actions to develop, request the development and/or to apply possible alternatives including a timetable for such actions by the applicant;
where appropriate, an indication of the information which should be regarded as proprietary accompanied by verifiable justification;
when applying for an exemption, proposal for a precise and clear wording for the exemption;
a summary of the application.
Signed for and on behalf of: …
(place and date of issue):
(name, function) (signature):
(referred to in Article 26)
Directive 2002/95/EC of the European Parliament and of the Council | (OJ L 37, 13.2.2003, p. 19). |
Commission Decision 2005/618/EC | (OJ L 214, 19.8.2005, p. 65). |
Commission Decision 2005/717/EC | (OJ L 271, 15.10.2005, p. 48). |
Commission Decision 2005/747/EC | (OJ L 280, 25.10.2005, p. 18). |
Commission Decision 2006/310/EC | (OJ L 115, 28.4.2006, p. 38). |
Commission Decision 2006/690/EC | (OJ L 283, 14.10.2006, p. 47). |
Commission Decision 2006/691/EC | (OJ L 283, 14.10.2006, p. 48). |
Commission Decision 2006/692/EC | (OJ L 283, 14.10.2006, p. 50). |
Directive 2008/35/EC of the European Parliament and of the Council | (OJ L 81, 20.3.2008, p. 67). |
Commission Decision 2008/385/EC | (OJ L 136, 24.5.2008, p. 9). |
Commission Decision 2009/428/EC | (OJ L 139, 5.6.2009, p. 32). |
Commission Decision 2009/443/EC | (OJ L 148, 11.6.2009, p. 27). |
Commission Decision 2010/122/EU | (OJ L 49, 26.2.2010, p. 32). |
Commission Decision 2010/571/EU | (OJ L 251, 25.9.2010, p. 28). |
(referred to in Article 26)
Directive | Deadline for transposition |
---|---|
2002/95/EC | 12 August 2004 |
2008/35/EC | — |
Directive 2002/95/EC | This Directive |
---|---|
Article 1 | Article 1 |
Article 2(1) | Article 2(1), 2(2), Annex I |
Article 2(2) | Article 2(3) |
Article 2(3) | Article 2(4), introductory wording |
— | Article 2(4) |
Article 3(a) | Article 3(1),(2) |
Article 3(b) | — |
— | Article 3(6)-(28) |
Article 4(1) | Article 4(1), Annex II |
— | Article 4(3)-(4) |
Article 4(2) | Article 4(6) |
Article 4(3) | — |
Article 5(1), introductory wording | Article 5(1), introductory wording |
Article 5(1)(a) | Article 4(2) |
Article 5(1)(b) | Article 5(1)(a), first and third indents |
— | Article 5(1)(a), second indent Article 5(1)(a), final paragraph |
Article 5(1)(c) | Article 5(1)(b) |
— | Article 5(2) Article 5(3)-(6) |
Article 5(2) | Article 5(7) |
— | Article 5(8) |
Article 6 | Article 6 |
— | Article 7-18 |
Article 7 | Articles 19-22 |
Article 8 | Article 23 |
Article 9 | Article 25 |
— | Article 26 |
Article 10 | Article 27 |
Article 11 | Article 28 |
— | Annexes I-II |
Annex, points 1-39 | Annex III, points 1-39 |
— | Annexes IV, V, VI-VIII |
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